Aeroflex Microelectronic Solutions

Aeroflex Microelectronic Solution divisions - Colorado Springs, Gaisler, Metelics, Plainview and RAD provide HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, high-altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, GPS receivers, networking and telecommunication markets.

Circuit Card Assembly

Providing Circuit Card Assembly for Aerospace and Commercial Requirements

Aeroflex Colorado Springs/Circuit Card Assembly offers a full turnkey electronic manufacturing operation, including assemblies, modules, systems complete with testing and coating capabilities, in a domestic facility.

We procure full Bills of Materials, qualify components where necessary, and
Build-to-Spec all volumes of boards.

Aeroflex recently completed their Ceramic Column Grid Array (CGA) package qualification with the assistance of Six Sigma Services.

Please call 800-645-8862 with all inquiries.

Manufacturing Leadership:

  • Assembly processes for both ANSI-J-STD-001 including DS/ES and NASA 8739
  • ISO 9001:2008 certified with AS9100:2004 Rev C value-added compliance
  • ESD Certified to ANSI-ESD S20.20 for assemblies and Integrated Circuits
  • Environmental and quality control systems. Colorado “Gold” award winner
  • Full ITAR compliance

Manufacturing Support Processes:

  • Turnkey or consigned manufacturing
    • Counterfeit Parts Control Program
    • Obsolescence and EOL parts management
    • Parts management to customer provided requirements (AVL, PAPL, PAMPL)
    • Component traceability by Lot Date Code or customer provided tracking process
  • Incoming XRF screening for all Military and Space programs (pure tin and speciality metal detection)
  • Component lead forming, part programming and post-delivery component level test screening as part of the assembly services

Manufacturing Expertise:

  • Automated surface mount and Plated through-hole assembly
  • Qualified Ceramic Column Grid Array (CGA) assembly
  • Automated Optical Inspection
  • 2D 360 degree rotational Real Time Xray
  • Burn-in capabilities at assembly, module and box level
  • Flying Probe
  • System Level Board testing capable
  • Shock, Vibration and Temperature
  • Conformal Coating to Mil-I-46058 standards